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BGA.JPG (39342 ??)
PCB Model BGA Board (Multilayer PCBs)
Base Material FR4
Layer 8L
Surface Finish Immersion Gold
Profile CNC
Min Hole dia 0,1 mm
Min Track width 0,1 mm
Min Track space 0,1 mm
Soldermask Green
Copper thickness 1oz. (=35um)
Special Procedure blind/buried via
pcb-02.jpg (95122 ??)
PCB Model FLX-6LA
Base Material FR4
Layer 6L
Surface Finish HAL(lead-free)
Profile CNC
Min Hole dia 0,1 mm
Min Track width 0,1 mm
Min Track space 0,1 mm
Soldermask Red
Copper thickness 1oz. (=35um)
Special Procedure blind/buried via
pcb-01.jpg (93911 ??)
PCB Model FLX-12LBB
Base Material FR4
Layer 12L
Surface Finish Chem. Ni/Au
Profile CNC
Min Hole dia 0,1 mm
Min Track width 0,1 mm
Min Track space 0,1 mm
Soldermask Green
Copper thickness 1oz. (=35um)
Special Procedure blind/buried via
pcb-03.jpg (90930 ??)
Product FLX-8L
Base Material FR4
Surface Finish Immersion Gold
Profile CNC
Min Hole dia 0,1 mm
Min Track width 0,1 mm
Min. Track space 0,1 mm
Soldermask Green
Copper Thickness 1oz. (=35um)
Special Procedure N/A
product7.jpg (143517 ??)
Product HDI Board : 2+4+2 GOLD
Base Material FR4
Surface Finish Immersion Gold
Profile CNC
Min Hole dia 0,2 mm
Min Track width 0,1 mm
Min. Track space 0,1 mm
Soldermask Green
Copper Thickness 1oz. (=35um)
Special Procedure BGA blind/buried via
product6.jpg (276847 ??)
Product HDI Board : 1+4+1 GOLD
Base Material FR4
Surface Finish Immersion Gold
Profile CNC
Min Hole dia 0,2 mm
Min Track width 0,1 mm
Min. Track space 0,1 mm
Soldermask Green
Copper Thickness 1oz. (=35um)
Special Procedure BGA blind/buried via
product8.jpg (170218 ??)
Product HDI Board : 1+6+1 GOLD
Base Material FR4
Surface Finish Immersion Gold
Profile CNC
Min Hole dia 0,2 mm
Min Track width 0,1 mm
Min. Track space 0,1 mm
Soldermask Green
Copper Thickness 1oz. (=35um)
Special Procedure BGA blind/buried via
PCB 6L.JPG (27702 ??)
Product FLX-6LB
Base Material FR4
Surface Finish Immersion Gold
Profile CNC
Min Hole dia 0,3 mm
Min Track width 0,1 mm
Min. Track space 0,1 mm
Soldermask Green
Copper Thickness 1oz. (=35um)
Special Procedure N/A
4.jpg (845821 ??)
Product FLX-2L
Base Material FR4
Surface Finish HAL(lead-free)
Profile CNC
Min Hole dia 0,3 mm
Min Track width 0,3 mm
Min. Track space 0,5 mm
Soldermask Blue
Copper Thickness 1oz. (=35um)
Special Procedure N/A
pcb-04.jpg (94475 ??)
Product FLX-10LBB
Base Material FR4
Surface Finish Chem. Ni/Au
Profile CNC
Min Hole dia 0,2 mm
Min Track width 0,1 mm
Min. Track space 0,1 mm
Soldermask Green
Copper Thickness 1oz. (=35um)
Special Procedure N/A

Address: Block 36, Phoenix Hill First Industrial Zone, 76 District, Bao'an, Shenzhen City, Guangdong Province, China

Tel:(+86)755- 2767 9274     Fax:(+86)755- 2785 9605      Zip code: 518102     

E-mail: sales@flxpcb.com.cn
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