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browsed 1008 Times
【 B M S】DAte：[ 2009-2-15 23:36:35]
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SERIAL
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ITEM |
TECHNICAL DATA |
| 1 |
Material |
FR4, High Tg FR4, PTFE, Metal Base, PI and so on |
| 2 |
Layers |
2~28 (layers) |
| 3 |
Max Board Size |
600 x 1000 mm |
| 4 |
Min Board Thickness |
4(layers) 0.40mm
6(layers) 0.80mm
8(layers) 1.00mm
10(layers)1.20mm |
| 5 |
PTH Wall Thickness |
>0.020mm |
| 6 |
Min Line Width |
0.075mm |
| 7 |
Min Line Space |
0.075mm |
| 8 |
Min Hole Size |
0.20mm |
| 9.1 |
Drilling Hole (Mechanical) |
0,15 mm ~ 6,35 mm |
|
9.2
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Final Hole (Mechanical) |
0,10 mm ~ 6,30 mm |
| 10 |
NPTH hole dia tolerance |
±0.025mm |
| 11 |
Hole Position Deviation |
±0.05mm |
| 12 |
Outline Tolerance |
±0.1mm |
| 13 |
S/M Pitch |
0.08mm |
| 14 |
Insulation Resistance |
1E+12O(Normal) |
| 15 |
Aspect ratio |
10 : 1 |
| 16 |
Thermal Shock |
3x10Sec@288°C(10 sec. 3 times) |
| 17 |
Warp and Twist |
<=0.7% |
| 18 |
Electric Strength |
>1.3KV/mm |
| 19 |
Peel Strength |
1.4N/mm |
| 20 |
Solder Mask Abrasion |
>=6H |
| 21 |
Flammability |
94V-0 |
| 22 |
Impedance Control |
±5% |
| 23 |
SMT Jointing Min.Space |
0.1mm |
| 24 |
QFP Space |
pitch 0.3mm |
| 25 |
Surface Treatment |
HAL(lead-free), HAL(lead), Chem. Ni/Au, Flash Gold, OSP, Chem. Tin, Chem. Ag, Gold Finger and so on |
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